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高速PCB设计系列基础知识64 | PCB设计后期处理之DFM检查 [复制链接]

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楼主    板儿妹0517 发表于: 2017-11-24 11:53:43 

[size=; font-size: 9pt,9pt]本期继续介绍PCB设计的后期处理方法,DFM检查中包含了哪些方面。[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]1.  PCB宽厚比要求:Y/Z≤150
[size=; font-size: 9pt,9pt][size=; font-size: 9pt,9pt]2.  传送边与非传送边之比要求:0.5≤X/Y≤5
[size=; font-size: 9pt,9pt]如果需要使用通用回流焊接工装PCB非传送边至少一边设计宽度≥5mm的器件禁布区[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]3.  PCB板厚大于3mm时,不推荐采用拼板设计或增加辅助边设计,拼板及辅助边主要有两种连接方式,V-CUT和实连接,在一块单板上只允许一种连接方式存在,优先V-CUT连接,V-CUT为直通型,V-CUT设计时PCB板厚要求:0.8mm≤板厚≤3mm[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]4.  V-CUT与PCB边缘线路或焊盘设计要求:[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]安全距离[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]s[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]板厚(mm)[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]1.6[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]2[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]2.5[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]3[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]外层线路(mm)[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]0.6[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]0.7[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]0.9[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]1[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]内侧线路(mm)[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]0.7[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]0.8[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]1[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]1.1[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]V-CUT分板机对PCB半边器件禁布要求[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]器件高度h(mm)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]器件禁布区要求(mm)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(0--3)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥1.0[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(3--5)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]≥1.6[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(5-10)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]≥2.0[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(10--13)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥3.5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(13--15)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥4.0[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(15--33)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥8.5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]h(33--∞)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥23[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]5. [size=; font-size: 9pt,9pt] 硬力敏感器件(如MLCC/BGA/陶瓷载板的晶振)与V-CUT连接处距离要求如下图:[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]应力敏感器件[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]距V-CUT连接处距离L(mm)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]BGA器件边缘[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]L≥5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]陶瓷电容0402[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]L≥3[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]陶瓷电容0603-0805[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] L≥5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]陶瓷电容1206-1210[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] L≥8[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]陶瓷电容1808及以上[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]L≥10[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]电感1812及以上[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] L≥4[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]磁珠1806及以上[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] L≥4[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]晶振sx4-0705[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] L≥4[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]6. 实连接[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]实连接适用于拼板、复杂、布局较密的拼板或辅助块等的连接[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]实连接对PCB的设计要求:PCB外形尺寸≤595mm*350mm,0.8mm≤板厚≤4mm[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]实连接处向外扩展0.5mm的区域内禁布器件,走线,铺铜及过孔[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]定位孔≥实连接边5mm[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]应力敏感器件[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]距实连接距离(mm)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]BGA器件边缘[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥2[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]陶瓷电容C0805及以下[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥1[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]C1206 C1210[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]≥1.5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]C1808及以上[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥2.5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]电感1812及以上[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥1[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]磁珠1806及以上[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥1[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]晶振sx4-0705[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt] ≥1[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]7.弯式连接器不推荐在V-CUT板边使用[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]/公,弯/母压接器件:与压接器件同面,压接器件周围3mm不得有高于3mm的元器件,周围1.5mm不得有任何焊接器件。在压接器件的反面,对pin间距≤4mm的压接器件,距离压接器件的插针孔中心2.5mm范围内不得有任何器件;对于pin间距大于4mm的压接器件,距离成孔孔径边缘2mm方形范围内禁布任何器件。[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]8.直/公,直/母压接器件:压接器件周围1mm不得有任何器件;对直/公,直/母压接器件其背面需安装护套时,距离护套边缘1mm范围内不得布置任何器件,不安装护套时距离压接孔中心2.5mm范围内不得布局任何器件。[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]9. 走线设计[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]线宽/线距设计与铜厚有关系,铜厚越大,则需要的线宽/线距就越大[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]铜厚[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]外层线宽/线距(mil)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]内层线宽/线距(mil)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]0.5Oz[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]4\5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]4\4[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]1.0Oz[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]5\5[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]4\4[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]2.0Oz[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]7\7[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]6\6[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]3.0Oz[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]8\8[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]8\8[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]外层走线和焊盘或字符阻焊开窗的距离≥3mil(孔边到边)[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]走线到板边≥20mil接地汇流及接地铜箔距板边≥20mil,走线到非金属化孔距离[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]孔径[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]走线距离孔边缘的距离[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]NPTH﹤80mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]邮票孔40mil(走线到NPTH﹤80mil邮票孔的距离为40mil)[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]安装孔 20mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]非安装孔 10mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]80mil﹤NPTH﹤120mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]安装孔 24mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]非安装孔 12mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]NPTH≥120mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]安装孔 32mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]非安装孔 16mil[size=; font-size: 9pt,9pt]

[size=; font-size: 9pt,9pt]10.电缆头之间的间隙≥8mm,以便手拿住插头插拔电览。[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]11. 板名,LOGO,防静电标识等不要放到插针印锡禁布区[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]12.  0402,细间间距的器件管脚禁止铺铜[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]13.背钻可减少stub,改善信号质量,采用背钻的PCB便面处理禁止使用HASL和LF-HASL[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]14.插件连接的层数布超过3层,并且过波峰焊的那面6MM禁布SMT器件[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]15.板的厚径比在8到12之间,超过需看厂家的加工能力[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]16. THD器件布局,THD器件除结构有特别要求之外,都必须放在正面,相邻元件本体之间的距离≧0.5mm[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]17.需要安装散热器的SMD应注意散热器的安装位置,散热器与SMD器件距离满足最小0.5mm的安装空间[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]当散热器件高度小于20mm时,距板边缘的距离大于10mm,当其高于20mm时距板边缘的距离大于15mm(对于拉手条一侧,或者单板边缘有其他防护结构的情况,不受此限制)[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]18. 二次电源[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]POL电源模块pin脚高度为2.84mm,要求Bottom面器件最大高度小于2.2mm;BMP电源模块插针凸台高度3.5mm,要求Bottom面器件布局最大高度小于3.0mm[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]19.厚铜PCB层叠设计[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]PCB推荐采用Foil叠法,要求0.8mm≤PCB板厚≤3mm,推荐≤3.0mm要求外层完铜厚度≤2Oz,内层底铜厚度≤5Oz,PCB层数≤12层,当完铜厚度≥3Oz或板厚≥2.5mm,禁止选择HASL表面处理[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]20.单板普通器件距离传送板边需大于5mm,SOP\QFP\QFN\排阻容、0402阻容距离传送板边需大于10mm[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]21.带有金属壳体的器件(金属拉手条、卧装电压调整器、铁氧体电感、晶振及DPAK、导销等)直接与PCB接触的区域不允许有走线,器件金属外壳与PCB接触区域向外延伸1.5mm表层禁布器件、信号线和过孔。带有金属壳体的连接器表层器件面禁止布线[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]22.条形码周围0402器件距离条形码10mm以上,如果开窗就5mm以上[size=; font-size: 9pt,9pt]
[size=; font-size: 9pt,9pt]以上便是PCB设计后期处理之DFM检查。
关键词: PCB设计 PCB设备 PCB
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沙发    asd2014 发表于: 2017-11-24 19:34:57 
专业内容,围观支持。
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板凳    chengdushao 发表于: 2018-01-17 11:30:50 
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